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TSOP62..
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
Description
The TSOP62.. - series are miniaturized SMD-IR Receiver Modules for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. TSOP62.. is the standard IR remote control SMD-Receiver series, supporting all major transmission codes.
1
2
3
4
16797
Features
* Photo detector and preamplifier in one package * Internal filter for PCM frequency e3 * Continuous data transmission possible * TTL and CMOS compatibility * Output active low * Low power consumption * High immunity against ambient light * Low power consumption * Lead (Pb)-free component * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
Special Features
* Improved immunity against ambient light * Suitable burst length 10 cycles/burst * Taping available for Topview and Sideview assembly
Mechanical Data
Pinning: 1 = GND, 2 = GND, 3 = VS, 4 = OUT
Parts Table
Part TSOP6230 TSOP6233 TSOP6236 TSOP6237 TSOP6238 TSOP6240 TSOP6256 Carrier Frequency 30 kHz 33 kHz 36 kHz 36.7 kHz 38 kHz 40 kHz 56 kHz
Block Diagram
3 30 k Input PIN
16839
Application Circuit
16842
VS
4 AGC Band Pass Demodulator
OUT
Circuit
Transmitter TSOPxxxx with TSALxxxx
R1 = 100 VS C1 = 4.7 F C VO GND + VS
OUT GND
1; 2 Control Circuit
GND
R1 and C1 recommended to suppress power supply disturbances. The output voltage should not be hold continuously a a voltage below VO = 3.3 V by the external circuit.
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors Absolute Maximum Ratings
Tamb = 25 C, unless otherwise specified Parameter Supply Voltage Supply Current Output Voltage Output Current Junction Temperature Storage Temperature Range Operating Temperature Range Power Consumption Tamb 85 C Pin 3 Pin 3 Pin 4 Pin 4 Test condition Symbol VS IS VO IO Tj Tstg Tamb Ptot Value - 0.3 to 6.0 5 - 0.3 to 6.0 15 100 - 40 to + 100 - 25 to + 85 50 Unit V mA V mA C C C mW
Electrical and Optical Characteristics
Tamb = 25 C, unless otherwise specified Parameter Supply Current Test condition VS = 5 V, Ev = 0 VS = 5 V, Ev = 40 klx, sunlight Supply Voltage Transmission Distance Ev = 0, test signal see fig. 1, IR diode TSAL6200, IF = 400 mA IOSL = 0.5 mA, Ee = 0.7 test signal see fig. 1 Minimum Irradiance (30 - 40 kHz) Minimum Irradiance (56 kHz) Maximum Irradiance Directivity Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Angle of half transmission distance Ee min 0.35 0.5 mW/m2 mW/m2, Symbol ISD ISH VS d 4.5 35 Min 0.8 Typ. 1.1 1.4 5.5 Max 1.5 Unit mA mA V m
Output Voltage Low (Pin 4)
VOSL
250
mV
Ee min
0.4
0.6
mW/m2
Ee max 1/2
30 50
W/m2 deg
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Typical Characteristics
Tamb = 25 C, unless otherwise specified
Ee
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms)
1.0
Ton ,Toff - Output Pulse Width (ms)
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.1 1.0 = 950 nm, optical test signal, fig. 3 Toff Ton
t tpi * * tpi VO VOH VOL td1 ) T 10/fo is recommended for optimal function
16110
Output Signal
1) 2)
7/f0 < td < 15/f0 tpi - 5/f 0 < tpo < tpi + 6/f 0 tpo2 ) t
16909
10.0 100.0 1000.0 10000.0 Ee - Irradiance (mW/m)
Figure 1. Output Function
Figure 4. Output Pulse Diagram
1.0 0.9 Output Pulse
1.2
t po - Output Pulse Width (ms)
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.1 1.0 = 950 nm, optical test signal, fig. 1 Input Burst Duration
E e min /E e - Rel. Responsivity
1.0 0.8 0.6 0.4 0.2 0.0 0.7 f = f0 5 % f (3 dB) = f0/10 0.9 1.1 f/f0 - Relative Frequency 1.3
10.0
100.0 1000.0 10000.0
16908
Ee - Irradiance (mW/m)
16925
Figure 2. Pulse Length and Sensitivity in Dark Ambient
Figure 5. Frequency Dependence of Responsivity
Ee
Optical Test Signal 4.0 Ee min - Threshold Irradiance (mW/m2 ) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.01 Ambient, = 950 nm
Correlation with ambient light sources: 10 W/m2 1.4 klx (Std.illum.A, T= 2855 K) 10 W/m2 8.2 klx (Daylight, T = 5900 K)
600 s T = 60 ms Output Signal, (see fig. 4)
600 s
t
94 8134
VO VOH VOL
Ton
Toff
t
16911
0.10 1.00 10.00 100.00 E - Ambient DC Irradiance (W/m 2)
Figure 3. Output Function
Figure 6. Sensitivity in Bright Ambient
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors
Ee min- Threshold Irradiance (mW/m)
2.0
Ee min - Threshold Irradiance (mW/m)
0.6 0.5 0.4 0.3 0.2 0.1 Sensitivity in dark ambient
1.5
f = fo f = 10 kHz
1.0
f = 1 kHz
0.5 f = 100 Hz 0.0 0.1 1.0 10.0 100.0 1000.0 VsRMS - AC Voltage on DC Supply Voltage (mV)
16912
0.0 - 30 - 15 0 15 30 45 60 75 16918 Tamb - Ambient Temperature (C)
90
Figure 7. Sensitivity vs. Supply Voltage Disturbances
Figure 10. Sensitivity vs. Ambient Temperature
1.2 E e min - Threshold Irradiance (mW/m)
2.0 f(E) = f0 1.6 1.2 0.8 0.4 0.0 0.0 0.4 0.8 1.2 1.6 2.0 E - Field Strength of Disturbance (kV/m)
S ( ) rel - Relative Spectral Sensitivity
1.0 0.8 0.6 0.4 0.2 0.0 750
850
950
1050
1150
94 8147
16919
- Wavelength (nm)
Figure 8. Sensitivity vs. Electric Field Disturbances
Figure 11. Relative Spectral Sensitivity vs. Wavelength
0.8 0.7 Max. Envelope Duty Cycle 0.6
0
10
20 30
40 0.5 0.4 0.3 0.2 0.1 0.0 0 f = 38 kHz, Ee = 2 mW/m2 0.7 1.0 0.9 0.8 50 60 70 80 20 40 60 80 100 120 Burst Length (number of cycles/burst) 0.6 0.4 0.2 0 0.2 0.4 0.6 d rel - Relative Transmission Distance
16913
16801
Figure 9. Max. Envelope Duty Cycle vs. Burstlength
Figure 12. Directivity
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Suitable Data Format
The circuit of the TSOP62.. is designed in that way that unexpected output pulses due to noise or disturbance signals are avoided. A bandpass filter, an integrator stage and an automatic gain control are used to suppress such disturbances. The distinguishing mark between data signal and disturbance signal are carrier frequency, burst length and duty cycle. The data signal should fulfill the following conditions: * Carrier frequency should be close to center frequency of the bandpass (e.g. 38 kHz). * Burst length should be 10 cycles/burst or longer. * After each burst which is between 10 cycles and 70 cycles a gap time of at least 14 cycles is necessary. * For each burst which is longer than 1.8 ms a corresponding gap time is necessary at some time in the data stream. This gap time should be at least 4 times longer than the burst. * Up to 800 short bursts per second can be received continuously. Some examples for suitable data format are: NEC Code (repetitive pulse), NEC Code (repetitive data), Toshiba Micom Format, Sharp Code, RC5 Code, RC6 Code, R-2000 Code, Sony Code. When a disturbance signal is applied to the TSOP62.. it can still receive the data signal. However the sensitivity is reduced to that level that no unexpected pulses will occur. Some examples for such disturbance signals which are suppressed by the TSOP62.. are: * DC light (e.g. from tungsten bulb or sunlight) * Continuous signal at 38 kHz or at any other frequency * Signals from fluorescent lamps with electronic ballast with high or low modulation (see Figure 13 or Figure 14).
IR Signal
IR Signal from fluorescent lamp with low modulation
0
16920
5
10 Time (ms)
15
20
Figure 13. IR Signal from Fluorescent Lamp with low Modulation
IR Signal from fluorescent lamp with high modulation
IR Signal
0
16921
10
10 Time (ms)
15
20
Figure 14. IR Signal from Fluorescent Lamp with high Modulation
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors Package Dimensions in mm
16629
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Assembly Instructions
Reflow Soldering * Reflow soldering must be done within 72 hours while stored under a max. temperature of 30 C, 60 % RH after opening the dry pack envelope. * Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Excercise extreme care to keep the maximum temperature below 260 C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured. * Handling after reflow should be done only after the work surface has been cooled off. Manual Soldering * Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 C. * Finish soldering within three seconds. * Handle products only after the temperature has cooled off.
Vishay Leadfree Reflow Solder Profile
300 250 200 T [C] max. 20 s 150 max. 120 sec 100 max. Ramp Up 3 C/sec 50 0 0
19800
255 C 240 C 217 C
max. 260 C 245 C
max. 100 sec max. Ramp Down 6 C/sec
50
100
150 t [sec]
200
250
300
max. 2 cycles allowed
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors Taping Version TSOP..TT
16584
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Taping Version TSOP..TR
16585
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors Reel Dimensions
16734
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Leader and Trailer
Trailer
no devices devices
Leader
no devices
End
min. 200 min. 400
Start
96 11818
Cover Tape Peel Strength
According to DIN EN 60286-3 0.1 to 1.3 N 300 10 mm/min 165 - 180 peel angle
Label
Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
Document Number 82177 Rev. 1.5, 23-Oct-06
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TSOP62..
Vishay Semiconductors
Vishay Semiconductor GmbH standard bar code product label (finished goods) Plain Writing Item-Description Item-Number Selection-Code LOT-/Serial-Number Data-Code Plant-Code Quantity Accepted by: Packed by: Mixed Code Indicator Origin Long Bar Code Top Item-Number Plant-Code Sequence-Number Quantity Total Length Short Bar Code Bottom Selection-Code Data-Code Batch-Number Filter Total Length Abbreviation INO SEL BATCH COD PTC QTY ACC PCK MIXED CODE xxxxxxx+ Type N N X N Type X N X Length 18 8 3 10 3 (YWW) 2 8 Company Logo Length 8 2 3 8 21 Length 3 3 10 1 17
16942
Dry Packing
The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.
Aluminium bag
Label
Reel
15973
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Document Number 82177 Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: * Storage temperature 10 C to 30 C * Storage humidity 60 % RH max. After more than 72 hours under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 hours at 40 C + 5 C/ - 0 C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 C + 5 C and < 5 % RH for all device containers or 24 hours at 125 C + 5 C not suitable for reel or tubes. An EIA JEDEC Standard JESD22-A112 Level 4 label is included on all dry bags.
16962
16943
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard Bar-Code Labels
The Vishay Semiconductors standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Telefunken specific data.
Document Number 82177 Rev. 1.5, 23-Oct-06 www.vishay.com 13
TSOP62..
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 82177 Rev. 1.5, 23-Oct-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 Revision: 08-Apr-05
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